Technological Breakthroughs Drive Industry Upgrades! JADA’s Next-Generation Microelectronics Metallization Solutions Empower Advanced Packaging for Mass Production
As the global semiconductor industry accelerates its evolution toward advanced packaging, microelectronics metallization—a critical process link—is confronting industry challenges of “higher density, better performance, and lower cost.” Recently, JADA Technology officially released its next-generation ultra-high aspect ratio via metallization process solution. Enabled by multiple technological breakthroughs, this solution provides mass production-ready core support for 2.5D/3D packaging and high-end PCB applications, drawing significant industry attention.
Cutting-Edge Technology Tackles Industry Pain Points
The newly released solution focuses on the industry challenge of “ultra-high aspect ratio through-hole metallization” in advanced packaging. It achieves a performance leap through three key technological innovations:
New Electroless Copper Formulation: A self-developed nano-scale catalytic system enables uniform copper deposition in through-holes with aspect ratios exceeding 20:1, with thickness variation controlled within 5%, significantly enhancing the electrical stability of packaged devices.
Plasma Pretreatment Process: An optimized surface activation technology resolves the issue of inadequate hole wall adhesion in conventional processes, improving yield by over 12% compared to the industry average.
Intelligent Process Control System: Equipped with AI-driven visual inspection and real-time closed-loop parameter adjustment algorithms, it dynamically fine-tunes process parameters to ensure stable mass production under complex conditions.
According to JADA’s technical lead, the solution has already been validated on the production lines of leading OSAT customers and is fully compatible with mainstream advanced packaging processes such as FCBGA and HBM, helping customers shorten time-to-market.
Ecosystem Collaboration to Build an Integrated Industry Chain
Behind this technological breakthrough lies JADA’s long-term commitment to deepening its presence across the industry chain. Alongside the solution launch, JADA announced a joint initiative—the “Advanced Packaging Process Collaborative Innovation Program”—with partners including Zhuoyan Intelligent Technology and Machvision Technology. The program integrates front-end equipment, materials, and back-end inspection capabilities to deliver one-stop services from process design to mass production handover.
“Microelectronics metallization is not a competition in a single segment, but the result of collaboration across the industry chain,” said the CEO of JADA Technology. “Through open cooperation, we aim to help build a stronger technology ecosystem for China’s advanced packaging industry and reduce reliance on external sources.”
Accelerating Domestic Substitution and Empowering Industry Upgrade
Against the backdrop of global semiconductor supply chain restructuring, JADA’s technological breakthrough holds significant industrial value. The solution has already secured orders from several top domestic OSAT companies, and multiple production line integrations are expected to be completed within the year. Industry experts note that JADA’s next-generation metallization solution not only fills a technological gap in China but also positions the country’s advanced packaging industry to take a more proactive role in global competition.
