Ultra-High Aspect Ratio Through-Hole Challenge
Under extreme 40:1 conditions, conventional plating bath exchange efficiency approaches zero, resulting in no copper deposition or voids in the hole center.
JADA Response: Enhanced Through-Plating (TP%)
Intelligent flow field simulation optimizes fluid jet pressure, paired with high-frequency pulse current reversal technology, ensuring precise deposition in the copper-depleted hole center with consistent TP%.
Deep Blind Microvia Filling (1.2:1)
High-aspect-ratio blind vias tend to trap bubbles at the bottom, creating serious reliability risks.
JADA Response: High-Performance Additives Synergy
Staged current guidance technology combined with ultrasonic assisted agitation eliminates micro-bubbles at the via bottom, achieving void-free filling with low dimple (<5μm).
5/5μm Ultra-Fine Circuitry
5-micron circuitry is extremely sensitive to physical contact; any roller or friction can cause defects.
JADA Response: Contactless Conveyance System
Air-flotation / magnetic levitation non-contact conveyance technology ensures boards never directly contact mechanical parts throughout the process, preserving mSAP pattern integrity.
Solution
